Extreme ultraviolet (EUV) exposure technology is revolutionizing the field of semiconductor manufacturing, but the market for equipment manufacturing for this technology is currently dominated by a very limited number of manufacturers. The most prominent one is ASML, which has an overwhelming share of the EUV equipment market. Other competing companies include Nikon and Canon, but it can be said that ASML is the only company that offers products specialized in EUV technology.
Problems with EUV exposure technology include high cost, light source durability and output stability, and equipment complexity. These problems are becoming major challenges in mass production as semiconductors become increasingly miniaturized.
Upon consideration, EUV exposure technology is very promising as the next generation lithography technology in the semiconductor industry, but technical challenges and high cost issues need to be resolved. Solving these challenges requires further research and development and technological innovation.
